Patents/Inventors

Yiqun Bai

Chandler, AZUS8 patents

8 Patents

US121304822024
Hydrophobic Feature to Control Adhesive Flow
Intel Corporation
0 cites
US120992452024
Completely Encapsulated Optical Multi Chip Package
Intel Corporation
0 cites
US120682222024
Dummy Die Structures of a Packaged Integrated Circuit Device
Intel Corporation
0 cites
US117495852023
High Thermal Conductivity, High Modulus Structure Within a Mold Material Layer of an Integrated Circuit Package
Intel Corporation
0 cites
US116886342023
Trenches in Wafer Level Packages for Improvements in Warpage Reliability and Thermals
Intel Corporation
0 cites
US115748512023
Coupled Cooling Fins in Ultra-small Systems
Intel Corporation
0 cites
US115629402023
Integrated Heat Spreader Comprising a Silver and Sintering Silver Layered Structure
Intel Corporation
0 cites
US115454072023
Thermal Management Solutions for Integrated Circuit Packages
Intel Corporation
0 cites