Patents/Inventors

Yinhua Cui

GuangzhouCN1 patent

2 Patents

US121129562024
Chip Interconnection Package Structure and Method
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites
US118698722024
Chip Stack Packaging Structure and Chip Stack Packaging Method
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites