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Yingshi Tang
Danville, CA
US
3 patents
3 Patents
US12568821
2026
Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages
Google LLC
0 cites
US12424509
2025
Compliant Pad Spacer for Three-dimensional Integrated Circuit Package
Google LLC
0 cites
US11955406
2024
Temperature Control Element Utilized in Device Die Packages
Google LLC
0 cites