5 Patents
- US125754322026Chip Fine Line Fan-out Package Structure and Manufacturing Method Therefor
Shenzhen Xiuyuan Electronic Technology Co., Ltd.
0 cites - US125062522025Fan-out Package Structure and Fabrication Method Therefor
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US121842532024Filter Radio Frequency Module Packaging Structure and Method for Manufacturing Same
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US117846252023Packaging Method and Package Structure for Filter Chip
GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
0 cites - US117106462023Fan-out Packaging Method and Fan-out Packaging Plate
SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
0 cites