Yingjiang Pu

6 Patents

• US122665832025

  Flip Chip Package Unit and Associated Packaging Method

  Chengdu Monolithic Power Systems Co., Ltd.

  0 cites
• US121597922024

  Flip Chip Package Unit Comprising Thermal Protection Film and Associated Packaging Method

  Chengdu Monolithic Power Systems Co., Ltd.

  0 cites
• US120027872024

  Multi-die Package Structure and Multi-die Co-packing Method

  Chengdu Monolithic Power Systems Co., Ltd.

  0 cites
• US118240012023

  Integrated Circuit Package Structure and Integrated Circuit Package Unit

  Chengdu Monolithic Power Systems Co., Ltd.

  0 cites
• US116706002023

  Panel Level Metal Wall Grids Array for Integrated Circuit Packaging

  Chengdu Monolithic Power Systems Co., Ltd.

  0 cites
• US116160172023

  Integrated Circuit Package Structure, Integrated Circuit Package Unit and Associated Packaging Method

  Chengdu Monolithic Power Systems Co., Ltd.

  0 cites