Patents/Inventors

Ying-hao Kuo

HsinchuTW1 patent

2 Patents

US116580442023
Thermally Conductive Structure for Heat Dissipation in Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115748862023
Thermally Conductive Molding Compound Structure for Heat Dissipation in Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites