Ying-chih Hsu

7 Patents

• US125001572025

  Semiconductor Package Device with Integrated Inductor and Manufacturing Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US124224702025

  Semiconductor Packages with Through via Structures and Methods for Testing the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121553072024

  Power Module

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120465442024

  Semiconductor Package Device with Integrated Inductor and Manufacturing Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US120027702024

  Power Management Semiconductor Package and Manufacturing Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US118555392023

  Power Module

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116710102023

  Power Delivery for Multi-chip-package Using In-package Voltage Regulator

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites