Patents/Inventors

Ying-cheng Tseng

TainanTW14 patents

14 Patents

US125577072026
Method of Fabricating Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123622742025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123344342025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122058602025
Sensor Packages
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121130222024
Semiconductor Package and Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120516662024
Package Structure and Manufacturing Method of Package Structure Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120150172024
Package Structure, Package-on-package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119293182024
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118552322023
Semiconductor Package and Forming Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118478522023
Manufacturing Method of Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118429932023
Semiconductor Device with Multiple Polarity Groups
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117422542023
Sensor Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116316582023
Under-bump-metallization Structure and Redistribution Layer Design for Integrated Fan-out Package with Integrated Passive Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115807672023
Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites