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Yin-chen Lin
Miaoli County
TW
2 patents
3 Patents
US12456673
2025
Flip Chip Package and Substrate Thereof
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US12089326
2024
Double-sided Flexible Circuit Board
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US11602047
2023
Circuit Board Tape and Joining Method Thereof
CHIPBOND TECHNOLOGY CORPORATION
0 cites