Yikang Deng

15 Patents

• US123569552025

  Pet Excrement Collecting Device Capable of Closing Excrement Collecting Bag

  SHENZHEN XINGRISHENG INDUSTRIAL CO., Ltd.

  0 cites
• US123361972025

  In-plane Inductors in IC Packages

  Intel Corporation

  0 cites
• US123227212025

  Asymmetric Stackup Structure for Soc Package Substrates

  Apple Inc.

  0 cites
• US122887442025

  Microelectronic Assemblies Having Conductive Structures with Different Thicknesses on a Core Substrate

  Intel Corporation

  0 cites
• US119554262024

  Package-integrated Multi-turn Coil Embedded in a Package Magnetic Core

  Intel Corporation

  0 cites
• US119233072024

  Microelectronic Structures Including Bridges

  Intel Corporation

  0 cites
• US118625972024

  Asymmetric Stackup Structure for Soc Package Substrates

  Apple Inc.

  0 cites
• US118308092023

  Magnetic Structures in Integrated Circuit Package Supports

  Intel Corporation

  0 cites
• US117697192023

  Dual Trace Thickness for Single Layer Routing

  Intel Corporation

  0 cites
• US117053772023

  Stacked Die Cavity Package

  Intel Corporation

  0 cites
• US116964072023

  Core Layer with Fully Encapsulated Co-axial Magnetic Material Around PTH in IC Package Substrate

  Intel Corporation

  0 cites
• US116518852023

  Magnetic Core Inductors

  Intel Corporation

  0 cites
• US116462542023

  Electronic Device Including a Lateral Trace

  Tahoe Research, Ltd.

  0 cites
• US116085642023

  Helical Plated Through-hole Package Inductor

  Intel Corporation

  0 cites
• USD09772082023

  Litter Box

  0 cites