Patents/Inventors

Yieok Kwon

Suwon-siKR3 patents

3 Patents

US125754182026
Semiconductor Packages Having Organic Material Layer Between Through-via Structure and Encapsulant That Surrounds a Portion of Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US121193052024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US115691752023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites