Patents/Inventors

Yidnekachew S. Mekonnen

Chandler, AZUS3 patents

4 Patents

US120739062024
Package Pin Pattern for Device-to-device Connection
Intel Corporation
0 cites
US117915282023
Low Loss and Low Cross Talk Transmission Lines with Stacked Dielectric Layers for Forming Stubs of Different Thickness or for Forming a Coaxial Line
Intel Corporation
0 cites
US117422932023
Multiple Die Package Using an Embedded Bridge Connecting Dies
Intel Corporation
0 cites
US115454162023
Minimization of Insertion Loss Variation in Through-silicon Vias (tsvs)
Intel Corporation
0 cites