Yian-liang Kuo

6 Patents

• US124313662025

  Structure Having Thermal Dissipation Structure Therein and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121598622024

  Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US119963682024

  Pad Structure for Enhanced Bondability

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119599582024

  Method of Analyzing Semiconductor Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US119357602024

  Package Structure Having Thermal Dissipation Structure Therein and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117282792023

  Pad Structure for Enhanced Bondability

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites