Patents/Inventors

Yi-lin Tsai

Taichung CityTW13 patents

12 Patents

US125936942026
Electronic Package and Substrate Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US125885222026
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US124447152025
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US122781732025
Electronic Package and Substrate Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121548482024
Electronic Package and Manufacturing Method Thereof, and Substrate Structure
Siliconware Precision Industries Co., Ltd.
0 cites
US121408632024
Imprint Method
UNITED MICROELECTRONICS Corp.
0 cites
US121365972024
Semiconductor Package Having an Interposer in Which One or More Dies Are Formed and Method of Forming the Same
MEDIATEK Inc.
0 cites
US120210312024
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US118811422024
Image Brightness Adjusting Method and Image Brightness Adjusting Device
Realtek Semiconductor Corp.
0 cites
US118549302023
Semiconductor Chip Package and Fabrication Method Thereof
Mediatek Inc.
0 cites
US118308512023
Semiconductor Package Structure
Mediatek Inc.
0 cites
US116705962023
Semiconductor Package Structure
MEDIATEK Inc.
0 cites