Yi-li Hsiao

3 Patents

• US124631752025

  Bonding with Pre-deoxide Process and Apparatus for Performing the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120274462024

  Method for Forming a Semiconductor Component with a Cooling Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119553782024

  Bonding Method of Package Components and Bonding Apparatus

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites