Patents/Inventors

Yi-jou Lin

HsinchuTW13 patents

14 Patents

US124447152025
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US123880262025
Electronic Package with Rotated Semiconductor Die
MEDIATEK Inc.
0 cites
US123344442025
Semiconductor Package Structure and Method for Forming the Same
MEDIATEK Inc.
0 cites
US121989962025
Integrated Fan-out Package, Package-on-package Structure, and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121837232024
Semiconductor Package with Dummy MIM Capacitor Die
MEDIATEK Inc.
0 cites
US121425982024
Semiconductor Package Structure Having an Annular Frame with Truncated Corners
MEDIATEK Inc.
0 cites
US120210312024
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US118625782024
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US118549302023
Semiconductor Chip Package and Fabrication Method Thereof
Mediatek Inc.
0 cites
US118308202023
Electronic Package with Rotated Semiconductor Die
MEDIATEK Inc.
0 cites
US118308512023
Semiconductor Package Structure
Mediatek Inc.
0 cites
US117282322023
Semiconductor Package Having a Stiffener Ring
Mediatek Inc.
0 cites
US116705962023
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US116462952023
Semiconductor Package Structure Having an Annular Frame with Truncated Corners
MEDIATEK Inc.
0 cites