Yeow Chon Ong

5 Patents

• US125061342025

  Fan-out Packaging for a Multichip Package

  Micron Technology, Inc.

  0 cites
• US124381132025

  Conductive Adhesive Assembly for Semiconductor Die Attachment

  Micron Technology, Inc.

  0 cites
• US123681132025

  Methods and Apparatus for Using Spacer-on-spacer Design for Solder Joint Reliability Improvement in Semiconductor Devices

  Micron Technology, Inc.

  0 cites
• US123622472025

  Semiconductor Devices with Flexible Spacer Including a Support Structure and Methods of Making the Same

  Micron Technology, Inc.

  0 cites
• US120806162024

  Reinforced Semiconductor Device Packaging and Associated Systems and Methods

  Micron Technology, Inc.

  0 cites