Patents/Inventors

Yeonjin Lee

Suwon-siKR26 patents

17 Patents

US126047272026
Semiconductor Chip Including Low-k Dielectric Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125544382026
Memory Device and Computing System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125506832026
Semiconductor Packages Having Test Pads
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123477472025
Semiconductor Devices Including a Through-hole Electrode
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122887342025
Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122305872025
Semiconductor Device with Crack-preventing Structure
Samsung Electronics Co., Ltd.
0 cites
US121990152025
Semiconductor Device Including via Structure and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US121836602024
Semiconductor Device Including Through-silicon via and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US120806632024
Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120723742024
Detection Pad Structure for Analysis in a Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites
US119488822024
Semiconductor Device and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US118174082023
Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117768942023
Semiconductor Chip Including Low-k Dielectric Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117568432023
Semiconductor Devices Including Scribe Lane and Method of Manufacturing the Semiconductor Devices
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116705592023
Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115878972023
Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115575562023
Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites