Patents/Inventors

Yeonho Jang

Suwon-siKR9 patents

9 Patents

US124827212025
Semiconductor Package Including Heat Dissipation Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122611042025
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120877442024
Semiconductor Package Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119012762024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118698352024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US117912952023
Semiconductor Package with Thick Under-bump Terminal
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370812023
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116160512023
Semiconductor Package Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691572023
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites