Patents/Inventors

Yeongseok Kim

Hwaseong-siKR4 patents

5 Patents

US123745752025
Debonding Tape and Method of Processing Semiconductor Wafer Using the Same
Samsung Electronics Co., Ltd.
0 cites
US121836532024
Thermal Conductive Film
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120626332024
Non-conductive Film Sheet and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US120574252024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120402132024
Processing Tape and Method of Fabricating a Semiconductor Device Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites