Patents/Inventors

Yeongbeom Ko

Suwon-siKR17 patents

12 Patents

US125885582026
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US125124292025
Semiconductor Device and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125139732025
Wafer Structure and Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites
US124514562025
Semiconductor Package Including Non-conductive Film and Method for Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US124128242025
Semiconductor Packages and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US123006672025
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120516842024
Face-to-face Semiconductor Device with Fan-out Porch
Micron Technology, Inc.
0 cites
US120150052024
Semiconductor Package Including Non-conductive Film and Method for Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US119424552024
Stacked Semiconductor Dies for Semiconductor Device Assemblies
Micron Technology, Inc.
0 cites
US117641612023
Ground Connection for Semiconductor Device Assembly
Micron Technology, Inc.
0 cites
US117496652023
Face-to-face Semiconductor Device with Fan-out Porch
Micron Technology, Inc.
0 cites
US116212452023
Microelectronic Device Packages with EMI Shielding, Methods of Fabricating and Related Electronic Systems
Micron Technology, Inc.
0 cites