Patents/Inventors

Yeohoon Yoon

Yongin-siKR2 patents

3 Patents

US124631682025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122180652025
Semiconductor Package Including Adhesive Layer and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US115575602023
Semiconductor Package for Improving Reliability
SAMSUNG ELECTRONICS CO., Ltd.
0 cites