Patents/Inventors

Yen-yao Chi

Hsin-ChuTW5 patents

6 Patents

US118547842023
Chip Scale Package Structure and Method of Forming the Same
Mediatek Inc.
0 cites
US118240202023
Semiconductor Package Structure Including Antenna
MEDIATEK Inc.
0 cites
US117912662023
Chip Scale Package Structure and Method of Forming the Same
Mediatek Inc.
0 cites
US117425642023
Fan-out Package Structure with Integrated Antenna
Mediatek Inc.
0 cites
US116522732023
Innovative Air Gap for Antenna Fan Out Package
Mediatek Inc.
0 cites
US115748812023
Semiconductor Package Structure with Antenna
Mediatek Inc.
0 cites