Patents/Inventors

Yen-liang Huang

KaohsiungTW2 patents

2 Patents

US125576302026
Package Structure with Interposer Encapsulated by an Encapsulant
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US118879282024
Package Structure with Interposer Encapsulated by an Encapsulant
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites