Yen Hao Lu

3 Patents

• US125730902026

  Encapsulation Positioning Mark Method

  SAULTECH TECHNOLOGY CO., Ltd.

  0 cites
• US123226392025

  Hybrid Bond Method for Fixing Dies

  0 cites
• US116949892023

  Die Bonding Method with Corner or Side Contact Without Impact Force

  SAULTECH TECHNOLOGY CO., Ltd.

  0 cites