Patents/Inventors

Yen-fu Su

HsinchuTW3 patents

4 Patents

US123623212025
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122305892025
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118943412024
Semiconductor Package with Through Vias and Stacked Redistribution Layers and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117054082023
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites