Yen-chun Lin

6 Patents

• US125576292026

  Interconnect Structure and Methods of Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US121659752024

  Method of Forming Interconnect Structure Having a Barrier Layer

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US120947702024

  Ruthenium-based Liner for a Copper Interconnect

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118108272023

  Finfet Device with Different Liners for PFET and NFET and Method of Fabricating Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US117422902023

  Interconnect Structure and Method of Forming Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US116886542023

  Test Line Structure, Semiconductor Structure and Method for Forming Test Line Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites