Yejin Park

5 Patents

• US126047392026

  Semiconductor Device and Method of Forming a 3-D Stacked Semiconductor Package Structure

  JCET STATS Chippac Korea Limited

  0 cites
• US125933972026

  Electronic Package and Method for Making the Same

  0 cites
• US125884962026

  Semiconductor Device and Data Storage System Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US125640602026

  Method for Forming a Partial Shielding for an Electronic Assembly

  0 cites
• US124447182025

  Semiconductor Device and Method of Forming Compartment Shielding for a Semiconductor Package

  JCET STATS Chippac Korea Limited

  0 cites