15 Patents
- US126222922026Two-sided Interconnected Embedded Chip Packaging Structure and Manufacturing Method Therefor
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US126222952026Signal-heat Separated TMV Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US126044142026Temporary Carrier Plate and Manufacturing Method Thereof, and Manufacturing Method for Packaging Substrate
Nantong ACCESS Semiconductor CO., Ltd.
0 cites - US125990192026Embedded Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US125327692026Package Substrate Based on Molding Process and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US124024142025Capacitor and Inductor Embedded Structure and Manufacturing Method Therefor, and Substrate
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US123005762025Cyclic Cooling Embedded Packaging Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US122782272025Hybrid Embedded Packaging Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US122305812025Multi-device Graded Embedding Package Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US120402722024Connector for Implementing Multi-faceted Interconnection
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US120405262024Method for Manufacturing Embedded Package Structure Having Air Resonant Cavity
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US119617432024Substrate Manufacturing Method for Realizing Three-dimensional Packaging
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd.
0 cites - US119031332024Structure for Embedding and Packaging Multiple Devices by Layer and Method for Manufacturing Same
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - 0 cites
- US116826212023Connector for Implementing Multi-faceted Interconnection
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites