Patents/Inventors

Yawei Liang

Chandler, AZUS2 patents

2 Patents

US118044702023
Wafer Level Passive Heat Spreader Interposer to Enable Improved Thermal Solution for Stacked Dies in Multi-chips Package and Warpage Control
Intel Corporation
0 cites
US115629402023
Integrated Heat Spreader Comprising a Silver and Sintering Silver Layered Structure
Intel Corporation
0 cites