Patents/Inventors

Yasuji Hara

AgeoJP2 patents

3 Patents

US124576862025
Roughened Copper Foil, Copper-cladded Laminate Board, and Printed Wiring Board
MITSUI MINING & SMELTING CO., Ltd.
0 cites
US123449532025
Electrolytic Copper Foil
MITSUI MINING & SMELTING CO., Ltd.
0 cites
US121688382024
Electrolytic Copper Foil
MITSUI MINING & SMELTING CO., Ltd.
0 cites