Patents/Inventors

Yasuhiro Hidaka

KanagawaJP13 patents

12 Patents

US125104912025
Apparatus for Inspecting Surface of Object
Samsung Electronics Co., Ltd.
0 cites
US124855982025
Operation Abnormality Detection Method, Method for Manufacturing Resin Container, Operation Abnormality Detection Device, Device for Manufacturing Resin Container, and Device for Manufacturing Resin Preform
NISSEI ASB MACHINE CO., Ltd.
0 cites
US123456262025
Ellipsometer and Apparatus for Inspecting Semiconductor Device Including the Ellipsometer
Samsung Electronics Co., Ltd.
0 cites
US123375172025
Mold Opening/closing Device and Method for Controlling Mold Opening/closing Device
NISSEI ASB MACHINE CO., Ltd.
0 cites
US123392232025
Measuring Apparatus and Testing Apparatus Having the Same
Samsung Electronics Co., Ltd.
0 cites
US123189902025
Resin Container Manufacturing Device and Manufacturing Method
NISSEI ASB MACHINE CO., Ltd.
0 cites
US122284992025
Pupil Ellipsometry Measurement Apparatus and Method and Method of Fabricating Semiconductor Device Using the Pupil Ellipsometry Measurement Method
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120769002024
Resin Molded Article Manufacturing Device, and Manufacturing Device Control Method
NISSEI ASB MACHINE CO., Ltd.
0 cites
US119582312024
Resin Container Manufacturing Device and Manufacturing Method
NISSEI ASB MACHINE CO., Ltd.
0 cites
US118856082024
Ellipsometer and Inspection Device for Inspecting Semiconductor Device Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117619062023
Optical Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116041362023
Pupil Ellipsometry Measurement Apparatus and Method and Method of Fabricating Semiconductor Device Using the Pupil Ellipsometry Measurement Method
SAMSUNG ELECTRONICS CO., Ltd.
0 cites