6 Patents
- US122388562025Heat Sink with Adaptive Curvature to Mitigate Thermal Runaway for a Circuit Component
CISCO TECHNOLOGY, Inc.
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- US121563242024Thermal Interface Material (TIM) Filling Structure for High Warpage Chips
Cisco Technology, Inc.
0 cites - US117787252023Thermal Interface Material (TIM) Filling Structure for High Warpage Chips
Cisco Technology, Inc.
0 cites - 0 cites