25 Patents
- US126160572026Double-sided Sip Packaging Structure Having Interposer Including a Groove and Manufacturing Method Thereof
JCET GROUP CO., Ltd.
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- US124698192025Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
STATS Chippac Pte. Ltd.
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- US124697912025Semiconductor Device and Method of Stacking Hybrid Substrates with Embedded Electric Components
STATS Chippac Pte. Ltd.
0 cites - US123811412025Semiconductor Device and Method of Forming Hybrid Substrate with Uniform Thickness
STATS Chippac Pte. Ltd.
0 cites - US123195642025Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
STATS Chippac Pte. Ltd.
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- US120947292024Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
STATS Chippac Pte. Ltd.
0 cites - US120806002024Semiconductor Device and Method to Minimize Stress on Stack Via
STATS Chippac Pte. Ltd.
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- US119786942024Dual-substrate Antenna Package Structure and Method for Manufacturing the Same
JCET GROUP CO., Ltd.
0 cites - US119617642024Semiconductor Device and Method of Making a Wafer-level Chip-scale Package
STATS Chippac Pte. Ltd.
0 cites - US118549492023Package Structure Having a Plurality of Chips Attached to a Lead Frame by Redistribution Layer
JCET GROUP CO., Ltd.
0 cites - US116886122023Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
STATS Chippac Pte Ltd.
0 cites - US115691362023Semiconductor Device and Method of Forming Dual-sided Interconnect Structures in FO-WLCSP
STATS Chippac Pte. Ltd.
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