Yao-pang Hsu

5 Patents

• US123881942025

  Antenna-in-module Package-on-package with Air Trenches

  MEDIATEK Inc.

  0 cites
• US120806142024

  Lidded Semiconductor Package

  MEDIATEK Inc.

  0 cites
• US119675702024

  Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure

  Mediatek Inc.

  0 cites
• US117054132023

  Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure

  MEDIATEK Inc.

  0 cites
• US116212112023

  Semiconductor Package Structure

  Mediatek Inc.

  0 cites