Patents/Inventors

Yann Mignot

Slingerlands, NYUS33 patents

29 Patents

US126222462026
Mandrel-pull-first Interconnect Patterning
International Business Machines Corporation
0 cites
US124648092025
Vertical Field Effect Transistor with Minimal Contact to Gate Erosion
International Business Machines Corporation
0 cites
US124380842025
Dual-metal Ultra Thick Metal (UTM) Structure
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US124008592025
Metal Hard Mask for Precise Tuning of Mandrels
International Business Machines Corporation
0 cites
US123694942025
MRAM Top Electrode Structure with Liner Layer
International Business Machines Corporation
0 cites
US122725452025
Embedded Metal Contamination Removal from BEOL Wafers
International Business Machines Corporation
0 cites
US122437702025
Hard Mask Removal Without Damaging Top Epitaxial Layer
International Business Machines Corporation
0 cites
US122371752025
Polymerization Protective Liner for Reactive Ion Etch in Patterning
International Business Machines Corporation
0 cites
US122074772025
Same Level MRAM Stacks Having Different Configurations
International Business Machines Corporation
0 cites
US121913882025
Area Scaling for VTFET Contacts
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US121486172024
Structure and Method to Pattern Pitch Lines
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US121425622024
Subtractive Metal Etch with Improved Isolation for BEOL Interconnect and Cross Point
International Business Machines Corporation
0 cites
US121425562024
X-ray Shielding Structure for a Chip
International Business Machines Corporation
0 cites
US121130132024
Dual Color via Patterning
International Business Machines Corporation
0 cites
US120947742024
Back-end-of-line Single Damascene Top via Spacer Defined by Pillar Mandrels
International Business Machines Corporation
0 cites
US120338562024
Litho-litho-etch (LLE) Multi Color Resist
International Business Machines Corporation
0 cites
US120109302024
Wrap-around Projection Liner for AI Device
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US119160132024
Via Interconnects Including Super Vias
International Business Machines Corporation
0 cites
US119014402024
Sacrificial Fin for Self-aligned Contact Rail Formation
International Business Machines Corporation
0 cites
US118496472023
Nonmetallic Liner Around a Magnetic Tunnel Junction
International Business Machines Corporation
0 cites
US118173892023
Multi-metal Interconnects for Semiconductor Device Structures
International Business Machines Corporation
0 cites
US118044012023
Spacer-defined Process for Lithography-etch Double Patterning for Interconnects
International Business Machines Corporation
0 cites
US117988422023
Line Formation with Cut-first Tip Definition
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US117841202023
Metal via Structure
International Business Machines Corporation
0 cites
US116886322023
Semiconductor Device with Linerless Contacts
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US116705802023
Subtractive via Etch for MIMCAP
International Business Machines Corporation
0 cites
US116463582023
Sacrificial Fin for Contact Self-alignment
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US116003252023
Non Volatile Resistive Memory Logic Device
International Business Machines Corporation
0 cites
US116005192023
Skip-via Proximity Interconnect
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites