Patents/Inventors

Yangyang Sun

NingdeCN32 patents

24 Patents

US126033772026
Protective Cover, Battery, Power Consuming Device, and Method for Manufacturing Protective Cover
CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
0 cites
US125605102026
Methods of Geometry Parameters Measurement for Optical Gratings
Applied Materials, Inc.
0 cites
US125001872025
Package Comprising an Interconnection Die Located Between Substrates
QUALCOMM INCORPORATED
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US125001882025
Flip-chip Bumping Metal Layer and Bump Structure
QUALCOMM INCORPORATED
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US124698112025
Package Comprising Wire Bonds Coupled to Integrated Devices
QUALCOMM INCORPORATED
0 cites
US124631272025
Integrated Circuit (IC) Package Employing a Re-distribution Layer (RDL) Substrate(s) with Photosensitive Dielectric Layer(s) for Increased Package Rigidity, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US123989982025
Methods for High-resolution, Stable Measurement of Pitch and Orientation in Optical Gratings
Applied Materials, Inc.
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US123861552025
Ultra-wide Angle Lens Systems with External Pupil
Applied Materials, Inc.
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US123792802025
Method of Measuring Efficiency for Optical Devices
Applied Materials, Inc.
0 cites
US123550002025
Package Comprising a Substrate and a High-density Interconnect Integrated Device
QUALCOMM INCORPORATED
0 cites
US122365752025
In-line Metrology Systems, Apparatus, and Methods for Optical Devices
Applied Materials, Inc.
0 cites
US122299402025
In-line Metrology Systems, Apparatus, and Methods for Optical Devices
Applied Materials, Inc.
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US122037472025
Interference In-sensitive Littrow System for Optical Device Structure Measurement
Applied Materials, Inc.
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US121653412024
Optical Resolution Measurement Method for Optical Devices
Applied Materials, Inc.
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US121130382024
Thermal Compression Flip Chip Bump for High Performance and Fine Pitch
QUALCOMM Incorporated
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US120192422024
Full-field Metrology Tool for Waveguide Combiners and Meta-surfaces
Applied Materials, Inc.
0 cites
US119885742024
Illumination System for AR Metrology Tool
Applied Materials, Inc.
0 cites
US119781962024
See-through Metrology Systems, Apparatus, and Methods for Optical Devices
0 cites
US119489092024
Package Comprising Spacers Between Integrated Devices
QUALCOMM INCORPORATED
0 cites
US119137762024
Interference In-sensitive Littrow System for Optical Device Structure Measurement
Applied Materials, Inc.
0 cites
US118087432023
Ion Chromatography (IC) Suppressor
QINGDAO SHENGHAN CHROMATOGRAPH TECHNOLOGY CO., Ltd.
0 cites
US117488752023
See-through Metrology Systems, Apparatus, and Methods for Optical Devices
Applied Materials, Inc.
0 cites
US116769222023
Integrated Device Comprising Interconnect Structures Having an Inner Interconnect, a Dielectric Layer and a Conductive Layer
QUALCOMM INCORPORATED
0 cites
US115575572023
Flip-chip Flexible Under Bump Metallization Size
QUALCOMM INCORPORATED
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