Patents/Inventors

Yangming Liu

ShanghaiCN4 patents

4 Patents

US120339582024
Semiconductor Device Including a Suspended Reinforcing Layer and Method of Manufacturing Same
Western Digital Technologies, Inc.
0 cites
US119857822024
Enclosure Fitting for Electronic Device
Western Digital Technologies, Inc.
0 cites
US119787132024
Flip Chip Bump with Multi-pi Opening
Western Digital Technologies, Inc.
0 cites
US119617782024
Semiconductor Device Package Having Multi-layer Molding Compound and Method
WESTERN DIGITAL TECHNOLOGIES, Inc.
0 cites