Yang Ti

3 Patents

• US125902282026

  Curable Adhesive Composition for Die Attach

  Henkel AG & Co. Kgaa

  0 cites
• US123447392025

  Conductive Epoxy Resin Composition for Copper Bonding

  Henkel AG & Co. Kgaa

  0 cites
• US120515222024

  Silver Sintering Composition Containing Copper Alloy for Metal Bonding

  HENKEL AG & Co. Kgaa

  0 cites