Patents/Inventors

Yang Lie Yong

BeijingCN1 patent

2 Patents

US120682332024
Adapter Board and Method for Forming Same, Packaging Method, and Package Structure
Semiconductor Manufacturing North China (Beijing) Corporation
0 cites
US116370592023
Adapter Board and Method for Forming Same, Packaging Method, and Package Structure
SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
0 cites