Patents/Inventors

Yang Liang Poh

Bukit MertajamMY2 patents

3 Patents

US121912812025
Multi-chip Package with Recessed Memory
Intel Corporation
0 cites
US118879172024
Encapsulated Vertical Interconnects for High-speed Applications and Methods of Assembling Same
Intel Corporation
0 cites
US115454342023
Vertical Die-to-die Interconnects Bridge
Intel Corporation
0 cites