Yang Gyoo Jung

3 Patents

• US123745582025

  Laser-assisted Bonding Apparatus for Bonding an Electronic Device to a Substrate

  Amkor Technology Singapore Holding Ptd. Ltd.

  0 cites
• US117422162023

  System and Method for Laser Assisted Bonding of an Electronic Device

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites
• US116643312023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites