Patents/Inventors

Ya-lien Lee

Baoshan TownshipTW12 patents

12 Patents

US125819252026
Selective Metal Cap in an Interconnect Structure
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123681032025
Diffusion Barrier Layer for Conductive via to Decrease Contact Resistance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549582025
Semiconductor Devices and Methods of Formation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123158092025
Via for Semiconductor Device and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US120681942024
Selective Deposition of Metal Barrier in Damascene Processes
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119617612024
Mitigating Pattern Collapse
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites
US119086972024
Interconnect Structure Having a Carbon-containing Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
0 cites
US118517492023
Semiconductor Device, Method and Machine of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118375002023
Selective Deposition of Metal Barrier in Damascene Processes and the Structures Formed Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118108572023
Via for Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117422912023
Diffusion Barrier Layer for Conductive via to Decrease Contact Resistance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116768982023
Diffusion Barrier for Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites