Patents/Inventors

Ya-jen Sheuh

Hsin-ChuTW2 patents

3 Patents

US122341452025
Methods for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121387352024
Multi-layered Windows for Use in Chemical-mechanical Planarization Systems
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US118513252023
Methods for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites