12 Patents
- US124556092025Heat Dissipation Control Method, and Electronic Apparatus and Portable Electronic Device to Which Heat Dissipation Control Method Is Applicable
ASUSTEK COMPUTER Inc.
0 cites - US122243592025Sensor Package Structure Having Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
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- US121085172024Sensor Lens Assembly Having Non-soldering Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US119845162024Sensor Package Structure Having Ring-shaped Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US119676522024Sensor Package Structure Having Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
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- US117440102023Sensor Lens Assembly Having Non-reflow Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites