Ya Fang Chan

4 Patents

• US125123372025

  Method for Manufacturing Semiconductor Package and Apparatus for Flattening Workpiece

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US122726872025

  Semiconductor Device Package with Conductive Pillars and Reinforcing and Encapsulating Layers

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US121070562024

  Semiconductor Device Package and the Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117912272023

  Electronic Device Package

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites