3 Patents
- US125754322026Chip Fine Line Fan-out Package Structure and Manufacturing Method Therefor
Shenzhen Xiuyuan Electronic Technology Co., Ltd.
0 cites - US121842532024Filter Radio Frequency Module Packaging Structure and Method for Manufacturing Same
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US121129562024Chip Interconnection Package Structure and Method
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites