4 Patents
- 0 cites
- US123411162025Chip Package Structure, Preparation Method, and Electronic Device
Huawei Technologies Co., Ltd.
0 cites - US118625292024Chip and Manufacturing Method Thereof, and Electronic Device
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - US117768202023Vertical Interconnection Structure and Manufacturing Method Thereof, Packaged Chip, and Chip Packaging Method
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites