Patents/Inventors

Xiaoying Guo

Chandler, AZUS24 patents

21 Patents

US126160522026
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites
US125123972025
Substrates Having Adhesion Promotor Layers and Related Methods
Intel Corporation
0 cites
US124567052025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US123610272025
Iterative Sampling Based Dataset Clustering
Microsoft Technology Licensing, LLC
0 cites
US123549922025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US123548832025
Omni Directional Interconnect with Magnetic Fillers in Mold Matrix
Intel Corporation
0 cites
US123411172025
Methods and Apparatus to Reduce Defects in Interconnects Between Semiconductor Dies and Package Substrates
Intel Corporation
0 cites
US123344222025
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites
US123083292025
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US122551302025
Airgap Structures for High Speed Signal Integrity
Intel Corporation
0 cites
US122097112025
Flammable and Explosive Liquid Transportation System and Method and Application Thereof
Sichuan Kelun Pharmaceutical Co., Ltd.
0 cites
US121748832024
Retrieval and Push Method Based on Fine Art Image Tag, and Use Thereof
Guangdong University Of Technology
0 cites
US121425672024
Coreless Architecture and Processing Strategy for Emib-based Substrates with High Accuracy and High Density
Intel Corporation
0 cites
US119904272024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119730412024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119554482024
Architecture to Manage FLI Bump Height Delta and Reliability Needs for Mixed EMIB Pitches
Intel Corporation
0 cites
US119488982024
Etch Barrier for Microelectronic Packaging Conductive Structures
Intel Corporation
0 cites
US119423342024
Microelectronic Assemblies Having Conductive Structures with Different Thicknesses
Intel Corporation
0 cites
US118811822024
Light-emitting Device Driver Chip, Backlight Module, and Display Panel
TCL China Star Optoelectronics Technology Co., Ltd.
0 cites
US117697352023
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US117637602023
Backlight Module and Display Device
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., Ltd.
0 cites