14 Patents
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- US124462912025Inverted Top-tier FET for Multi-tier Gate-on-gate 3-dimension Integration (3di)
TOKYO ELECTRON LIMITED
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- US121762932024Inter-tier Power Delivery Network (PDN) for Dense Gate-on-gate 3D Logic Integration
TOKYO ELECTRON LIMITED
0 cites - USD10487002024Thread Spool0 cites
- US120452712024Methods and Systems for Facilitating the Creation of Food And/or Beverage Product Concepts
Societe Des Produits Nestle S.A.
0 cites - US120010522024Radiation-resistant Laser Optical Fiber Preform Core Rod and Preparation Method Therefor
SHANGHAI INSTITUTE OF OPTICS AND FINE MECHANICS, CHINESE ACADEMY OF SCIENCES
0 cites - US119599502024Method and Apparatus for Power Measurement in Electronic Circuit Design and Analysis
Arm Limited
0 cites - US118308522023Multi-tier Backside Power Delivery Network for Dense Gate-on-gate 3D Logic
TOKYO ELECTRON LIMITED
0 cites - US117807682023Photodarkening-resistant Ytterbium-doped Quartz Optical Fiber and Preparation Method Therefor
SHANGHAI INSTITUTE OF OPTICS AND FINE MECHANICS, CHINESE ACADEMY OF SCIENCES
0 cites - US117261162023Method and Apparatus for On-chip Power Metering Using Automated Selection of Signal Power Proxies
Arm Limited
0 cites - US116503412023Method and System for Analyzing Seismic Active Field Based on Expansion of Empirical Orthogonal Function
Earthquake Agency Of Ningxia Hui Autonomous Region
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